Multilayer substrate, method for manufacturing multilayer substrate, and electronic device

A multilayer substrate including a plurality of insulating layers, and a plurality of metal layers which are formed on both surfaces of each of the insulating layers, and which are patterned, wherein interlayer coupling between the metal layers is achieved with a via, the multilayer substrate being characterized by including:

• a layer interlayer-coupled with a plated via;
• a layer interlayer-coupled with a paste via filled with a conductive paste;
• and a plurality of plated-via laminated bodies having insulating layers, the metal layers of which are interlayer-coupled with the plated via is provided, and the plurality of plated-via laminated bodies is laminated by being electrically coupled with the paste via filled with the conductive paste, wherein the plated via and the paste via overlap each other in a vertical direction, and wherein the plated via and the paste via are electrically connected to each other.