Component Carrier With Embedded Vertical Connection, And Manufacture Method

A method of manufacturing a component carrier, the method comprising:

• forming a stack having a plurality of electrically insulating layer structures and a plurality of electrically conductive layer structures;
• encapsulating at least one electrically vertical connection by a dielectric material of a first electrically insulating layer structure of the plurality of electrically insulating layer structures of the stack,
• wherein the at least one electrically vertical connection comprises at least one pad and at least one pillar connected to each other,
• wherein the at least one pad is exposed at a first main surface of the first electrically insulating layer structure and the at least one pillar is exposed at a second main surface of the first electrically insulating layer structure;
• wherein the exposed surface of the at least one pad and/or the exposed surface of the at least one pillar comprises a connection structure configured to be connected to at least one of the plurality of electrically conductive layer structures, and
• wherein the dielectric material exposed at the respective main surface of the first electrically insulating layer structure where the connection structure is exposed, is in direct contact with a second electrically insulating layer structure of the plurality of electrically insulating layer structures.