H05K 3/4038
Through-connections
Official title: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
H05K3/4038 (Through-connections) appears on 3,047 US grants and 2,903 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,047
- Published applications
- 2,903
- Assignees
- 1,032
- Inventors
- 6,005
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 11 | 0 |
| 1978 | 13 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 6 | 0 |
| 1982 | 11 | 0 |
| 1983 | 9 | 0 |
| 1984 | 10 | 0 |
| 1985 | 21 | 0 |
| 1986 | 18 | 0 |
| 1987 | 24 | 0 |
| 1988 | 25 | 0 |
| 1989 | 30 | 0 |
| 1990 | 25 | 0 |
| 1991 | 28 | 0 |
| 1992 | 39 | 0 |
| 1993 | 42 | 0 |
| 1994 | 41 | 0 |
| 1995 | 58 | 0 |
| 1996 | 54 | 0 |
| 1997 | 72 | 0 |
| 1998 | 58 | 0 |
| 1999 | 77 | 0 |
| 2000 | 74 | 0 |
| 2001 | 87 | 53 |
| 2002 | 106 | 140 |
| 2003 | 123 | 131 |
| 2004 | 129 | 156 |
| 2005 | 104 | 120 |
| 2006 | 81 | 112 |
| 2007 | 80 | 113 |
| 2008 | 72 | 134 |
| 2009 | 52 | 137 |
| 2010 | 79 | 101 |
| 2011 | 78 | 99 |
| 2012 | 94 | 98 |
| 2013 | 88 | 104 |
| 2014 | 69 | 111 |
| 2015 | 63 | 85 |
| 2016 | 91 | 97 |
| 2017 | 95 | 140 |
| 2018 | 106 | 132 |
| 2019 | 153 | 131 |
| 2020 | 110 | 116 |
| 2021 | 95 | 106 |
| 2022 | 84 | 87 |
| 2023 | 64 | 83 |
| 2024 | 70 | 74 |
| 2025 | 62 | 94 |
| 2026 | 43 | 149 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer substrate, method for manufacturing multilayer substrate, and electronic device6 Oct 2026US 12,757,329 B2Fict Limited
- Connection structure for yarn wire and circuit board15 Sep 2026US 12,739,980 B2Makalot Industrial Co., Ltd.
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Antenna-on-package system1 Sep 2026US 12,727,084 B2Texas Instruments Incorporated
- Mating backplane for high speed, high density electrical connector25 Aug 2026US 12,720,680 B2Amphenol Corporation
- Component Carrier With Embedded Vertical Connection, And Manufacture Method1 Oct 2026US 2026/0304619 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Manufacturing method for long circuit board and long circuit board1 Oct 2026US 2026/0304643 A1
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board and manufacturing method of circuit board17 Sep 2026US 2026/0282224 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Method and apparatus for 3D interconnect542US 8,076,237 B2ASM America, Inc. · 2011
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997