Antenna-on-package system

A method for fabricating an antenna-on-package (AoP) system, the method comprising:

• forming a first metal layer on a carrier surface, the first metal layer comprising a first transmission line;
• forming a first via that extends from an end of the first transmission line;
• forming a first dielectric layer over the first metal layer, the first dielectric layer surrounding the first via;
• forming a second metal layer over the first dielectric layer, the second metal layer comprising a second transmission line that is communicatively coupled to the first via at a first end of the second transmission line;
• forming a second via that extends from a second end of the second transmission line opposite the first end;
• forming a second dielectric layer over the second metal layer, the second dielectric layer surrounding the second via;
• forming a third metal layer comprising an antenna portion and a third transmission line that extends between the antenna portion and the second via;
• and
• removing the AoP system from the carrier surface.

A communication system comprising:

• a printed circuit board (PCB) comprising a drilled-via waveguide;
• and
• an antenna-on-package (AoP) system, the AoP system comprising:
• a first transmission line configured to propagate a radio frequency signal on a first metal layer, the first metal layer being arranged to be coupled to the PCB such that the drilled-via waveguide is communicatively coupled to the first transmission line;
• an antenna portion patterned on a second metal layer, the first and second metal layers being separated by at least one dielectric layer;
• and
• a coaxial transition portion comprising a via configured to communicatively couple the first transmission line on the first metal layer to a second transmission line on the second metal layer, the second transmission line being coupled to the antenna portion, wherein the coaxial transition portion comprises:
• a first coaxial transition portion comprising a first via configured to communicatively couple the first transmission line on the first metal layer to a third transmission line on a third metal layer, the third metal layer being arranged between the first and second metal layers and being separated from the first metal layer by a first dielectric layer and being separated from the second metal layer by a second dielectric layer;
• and
• a second coaxial transition portion comprising a second via configured to communicatively couple the third transmission line on the third metal layer to the antenna portion on the second metal layer.