H05K 3/4084
By deforming at least one of the conductive layers
Official title: {by deforming at least one of the conductive layers}
H05K3/4084 (By deforming at least one of the conductive layers) appears on 261 US grants and 157 published applications in this corpus.
Search patents in H05K- Granted patents
- 261
- Published applications
- 157
- Assignees
- 141
- Inventors
- 486
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 8 | 0 |
| 1988 | 8 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 13 | 0 |
| 2000 | 15 | 0 |
| 2001 | 14 | 9 |
| 2002 | 16 | 5 |
| 2003 | 15 | 9 |
| 2004 | 5 | 13 |
| 2005 | 10 | 14 |
| 2006 | 8 | 6 |
| 2007 | 7 | 8 |
| 2008 | 7 | 11 |
| 2009 | 4 | 5 |
| 2010 | 3 | 8 |
| 2011 | 4 | 8 |
| 2012 | 6 | 5 |
| 2013 | 6 | 5 |
| 2014 | 2 | 6 |
| 2015 | 4 | 7 |
| 2016 | 10 | 6 |
| 2017 | 6 | 8 |
| 2018 | 7 | 4 |
| 2019 | 5 | 3 |
| 2020 | 4 | 4 |
| 2021 | 3 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 5 |
| 2024 | 5 | 2 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Semiconductor connection components and methods with releasable lead support217US 5,536,909 ATessera, Inc. · 1996
- Microelectronic mounting with multiple lead deformation and bonding201US 5,801,441 ATessera, Inc. · 1998
- Fan-out semiconductor chip assembly189US 5,688,716 ATessera, Inc. · 1997