Wiring circuit board and method of producing the same

A wiring circuit board comprising:

• an insulating layer having a via penetrating in a thickness direction;
• a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer;
• a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer;
• and
• a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first conductive layer and the second conductive layer,
• wherein a length (L) that is measured as follows is 1 μm or more and 10 μm or less;
• wherein the length (L) is obtained by drawing a segment (S) joining a first connection point (C1) and a second connection point (C2) in a cross-sectional view of the wiring circuit board;
• wherein the first connection point (C1) is a point at which the one-side surface in the thickness direction of the insulating layer and the inner peripheral surface are connected;
• wherein the second connection point (C2) is a point at which the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface are connected;
• wherein an outermost position (P) that is farthest outward from the segment (S) on the inner peripheral surface in the cross-sectional view is identified;
• and
• wherein the length (L) as the shortest distance from the segment (S) to the outermost position (P) is measured.