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US 2023/0354527 A1Published application
Electrical connections to embedded electronic components
Assignee3M Innovative Properties Company
InventorsAnkit Mahajan, Mikhail L. Pekurovsky, Kara A. Meyers, Saagar A. Shah, Kayla C. Niccum
Life of this patent
Estimating the term…
Abstract
Devices including electrical connections to embedded electronic components and methods of making the same are provided. The devices include a flexible electronic component buried inside a substrate. The free end of the flexible electronic component can be extracted to stick out of the major plane of the substrate as a projecting contact.
Claims20
A method of making a flexible device, comprising:
- providing a flexible substrate extending along a major plane;
- providing a flexible electronic component including a free end buried inside the flexible substrate;
- and
- extracting the free end of the flexible electronic component such that the free end projects out of the major plane of the flexible substrate.
1 more element
A flexible device comprising:
- a flexible substrate extending along a major plane;
- and
- a flexible electronic component buried inside the flexible substrate,
- wherein the flexible electronic component includes a free end sticking out of the major plane of the flexible substrate.
1 more element
A method of making a device comprising:
- providing a circuit board including one or more contact pads on a major surface thereof;
- providing an electrically conductive element disposed on the major surface of the circuit board, in contact with the one or more contact pads;
- providing an adhesive film adhesively bonded to the major surface of the circuit board to secure the electrically conductive element thereon, the adhesive film including one or more through holes aligned with the one or more contact pads of the circuit board;
- providing a conductive particle-containing liquid in the one or more through holes to contact the one or more contact pads;
- and
- solidifying the conductive particle-containing liquid to form one or more electrodes to electrically connect to the one or more contact pads of the circuit board and the electrically conductive element.
3 more elements
A device comprising:
- a circuit board including one or more contact pads on a major surface thereof;
- an electrically conductive element disposed on the major surface of the circuit board, in contact with the one or more contact pads;
- an adhesive film adhesively bonded to the major surface of the circuit board to secure the electrically conductive element thereon, the adhesive film including one or more through holes aligned with the one or more contact pads of the circuit board;
- and
- one or more electrodes formed in the one or more through holes of the adhesive film to electrically connect to the one or more contact pads of the circuit board and the electrically conductive element.
2 more elements
Dependencies are inferred from the claim text.