Back to results
US 2026/0282224 A1Published application
Circuit board and manufacturing method of circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYoungwoong Cho
Life of this patent
Estimating the term…
Abstract
A circuit board includes an insulating layer having a via hole, a via filling the via hole, a circuit layer disposed on the insulating layer and including a pad connected to the via and a circuit wiring spaced apart from the pad, and a carbon pattern layer disposed between the circuit layer and a surface of the insulating layer.
Claims22
A circuit board comprising:
- an insulating layer having a via hole;
- a via filling the via hole;
- a circuit layer disposed on the insulating layer, and comprising a pad connected to the via and a circuit wiring spaced apart from the pad;
- and
- a carbon pattern layer disposed between the circuit layer and a surface of the insulating layer.
2 more elements
A manufacturing method of a circuit board, comprising:
- forming a via hole penetrating an insulating layer;
- forming a seed layer on a surface of the insulating layer in which the via hole is formed;
- forming a first mask pattern on the first seed layer to expose the seed layer of the via hole and its surrounding area;
- forming a via formation layer on the seed layer exposed by the first mask pattern;
- exposing the insulating layer by removing the first mask pattern and the via formation layer disposed on the insulating layer;
- applying a carbon layer to a surface of the exposed insulating layer;
- forming a second mask pattern on the carbon layer;
- forming a circuit layer on the carbon layer exposed by the second mask pattern;
- exposing the carbon layer by removing the second mask pattern disposed on the carbon layer;
- and
- removing the exposed carbon layer.
8 more elements
Dependencies are inferred from the claim text.