H05K 3/4076
By thin-film techniques
Official title: {by thin-film techniques}
H05K3/4076 (By thin-film techniques) appears on 171 US grants and 104 published applications in this corpus.
Search patents in H05K- Granted patents
- 171
- Published applications
- 104
- Assignees
- 108
- Inventors
- 384
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 7 | 0 |
| 1990 | 8 | 0 |
| 1991 | 5 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 4 | 0 |
| 1995 | 10 | 0 |
| 1996 | 9 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 3 |
| 2004 | 4 | 7 |
| 2005 | 1 | 1 |
| 2006 | 3 | 4 |
| 2007 | 0 | 2 |
| 2008 | 3 | 2 |
| 2009 | 0 | 1 |
| 2010 | 3 | 5 |
| 2011 | 1 | 2 |
| 2012 | 3 | 1 |
| 2013 | 0 | 3 |
| 2014 | 3 | 2 |
| 2015 | 2 | 2 |
| 2016 | 3 | 3 |
| 2017 | 5 | 9 |
| 2018 | 4 | 12 |
| 2019 | 10 | 9 |
| 2020 | 10 | 6 |
| 2021 | 3 | 7 |
| 2022 | 3 | 3 |
| 2023 | 5 | 2 |
| 2024 | 4 | 5 |
| 2025 | 1 | 9 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Wiring circuit board and method of producing the wiring circuit board4 Nov 2025US 12,464,642 B2Nitto Denko Corporation
- Resin multilayer substrate and method for manufacturing resin multilayer substrate16 Jul 2024US 12,036,776 B2Murata Manufacturing Co., Ltd.
- Assembly structure for vehicle camera module using solder-jet2 Jul 2024US 12,025,848 B2Hyundai Mobis Co., Ltd.
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Electronic device and manufacturing method thereof16 Jul 2026US 2026/0206137 A1Innolux Corporation
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Wiring circuit board and method of producing the wiring circuit board5 Feb 2026US 2026/0040442 A1Nitto Denko Corporation
- Circuit board and method of circuit plating thereof27 Nov 2025US 2025/0365866 A1Unimicron Technology Corp.
Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
- Process for producing electrical connections through a substrate191US 4,964,212 ACommissariat A L' Energie Atomique · 1990
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992