Electronic device and manufacturing method thereof

Abstract

A manufacturing method of an electronic device includes: providing a substrate; forming a through hole penetrating the substrate; providing a seed layer, the seed layer extending into the through hole; performing a first coating step to form a first coating on a surface of the seed layer, the first coating filling a portion of the through hole; and performing a second coating step to form a second coating on a portion of the surface of the seed layer, the second coating filling another portion of the through hole and connected to the first coating. A current density used in the first coating step is greater than a current density used in the second coating step.

Dependencies are inferred from the claim text.