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US 12,036,776 B2Granted
Resin multilayer substrate and method for manufacturing resin multilayer substrate
AssigneeMurata Manufacturing Co., Ltd.
InventorsYusuke Kamitsubo, Tsuyoshi Katsube, Ryosuke Takada
Life of this patent
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Abstract
A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.
Claims9
A resin multilayer substrate comprising:
- a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
- a via conductor in the first resin layer;
- a joint portion including at least a portion in the second resin layer and joined to the via conductor;
- and
- a conductor in the laminate and connected to the via conductor by the joint portion;
- wherein
- the joint portion is more brittle than the via conductor;
- a Vickers hardness of the joint portion is lower than a Vickers hardness of the via conductor;
- and
- a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.
7 more elements
A resin multilayer substrate comprising:
- a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
- a via conductor in the first resin layer;
- a joint portion including at least a portion in the second resin layer and joined to the via conductor;
- a conductor in the laminate and connected to the via conductor by the joint portion;
- and
- a planar conductor in the laminate;
- wherein
- the joint portion is more brittle than the via conductor;
- a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer;
- the via conductor has a circular or substantially circular truncated cone shape including a first surface and a second surface larger than the first surface;
- the first surface of the via conductor is connected to the planar conductor and the second surface of the via conductor is joined to the joint portion;
- and
- the planar conductor and the via conductor are made of a same material.
10 more elements
A resin multilayer substrate comprising:
- a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
- a via conductor in the first resin layer;
- a joint portion including at least a portion in the second resin layer and joined to the via conductor;
- and
- a conductor in the laminate and connected to the via conductor by the joint portion;
- wherein
- the joint portion is more brittle than the via conductor;
- a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer;
- a relative permittivity of the first resin layer is lower than a relative permittivity of the second resin layer;
- and
- a thickness of the first resin layer is larger than a thickness of the second resin layer.
8 more elements
A resin multilayer substrate comprising:
- a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
- a via conductor in the first resin layer;
- a joint portion including at least a portion in the second resin layer and joined to the via conductor;
- and
- a conductor in the laminate and connected to the via conductor by the joint portion;
- wherein
- the joint portion is more brittle than the via conductor;
- a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer;
- and
- the plurality of resin layers are made of thermoplastic resin.
7 more elements
A resin multilayer substrate, comprising:
- a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
- a via conductor in the first resin layer;
- a joint portion including at least a portion in the second resin layer and joined to the via conductor;
- and
- a conductor in the laminate and connected to the via conductor by the joint portion;
- wherein
- the joint portion is more brittle than the via conductor;
- a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer;
- and
- the laminate includes a bent portion.
7 more elements
Dependencies are inferred from the claim text.