H05K 3/4053
By thick-film techniques
Official title: {by thick-film techniques}
H05K3/4053 (By thick-film techniques) appears on 1,451 US grants and 1,344 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,451
- Published applications
- 1,344
- Assignees
- 536
- Inventors
- 2,948
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 9 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 11 | 0 |
| 1989 | 8 | 0 |
| 1990 | 12 | 0 |
| 1991 | 9 | 0 |
| 1992 | 23 | 0 |
| 1993 | 21 | 0 |
| 1994 | 22 | 0 |
| 1995 | 28 | 0 |
| 1996 | 30 | 0 |
| 1997 | 49 | 0 |
| 1998 | 39 | 0 |
| 1999 | 37 | 0 |
| 2000 | 43 | 0 |
| 2001 | 46 | 36 |
| 2002 | 64 | 105 |
| 2003 | 75 | 87 |
| 2004 | 87 | 104 |
| 2005 | 67 | 81 |
| 2006 | 53 | 70 |
| 2007 | 53 | 67 |
| 2008 | 48 | 81 |
| 2009 | 30 | 92 |
| 2010 | 45 | 64 |
| 2011 | 46 | 53 |
| 2012 | 57 | 54 |
| 2013 | 52 | 47 |
| 2014 | 34 | 45 |
| 2015 | 26 | 28 |
| 2016 | 33 | 29 |
| 2017 | 25 | 28 |
| 2018 | 28 | 43 |
| 2019 | 45 | 36 |
| 2020 | 32 | 45 |
| 2021 | 25 | 32 |
| 2022 | 28 | 32 |
| 2023 | 26 | 25 |
| 2024 | 25 | 17 |
| 2025 | 15 | 25 |
| 2026 | 9 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board7 Jul 2026US 12,677,381 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof23 Jun 2026US 12,666,546 B2Fict Limited
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor5 May 2026US 12,621,938 B2
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Printed wiring board16 Jul 2026US 2026/0206136 A1Fujikura Ltd.
- Integrated system for textile hybrid electronics via laser hybrid manufacturing9 Jul 2026US 2026/0197947 A1Zhejiang University
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995