Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor

A manufacturing method of circuit board structure with shielding and heat dissipation functions, comprising steps of:

• Step A:
• using a control processing device to select a processing area on a circuit board where multiple electronic components are set on said circuit board, and calculating multiple marking points based on the area where said multiple electronic components are not set in said processing area, wherein said marking points are selectively in a shape of points, lines or irregular shapes, and said circuit board comprises at least one layer of copper foil layer capable of forming a contact surface;
• Step B:
• using a preset glue dispenser to place points one by one on a surface of said circuit board at a preset distance to form said marking points;
• Step C:
• using a first preset atomizer to spray a water-based environmentally friendly paint on the surface of said circuit board, which said water-based environmentally friendly paint comprising a base material with a weight percentage of about 20% to 50%, a heat dissipation material with a weight percentage of about 10% to 40%, a polymer material cross-linking agent with a weight percentage of about 0.5% to 30% and a deionized water with a weight percentage of about 10% to 30%, so as to form a first insulating layer on the surface of said circuit board when said water-based environmentally friendly paint is solidified;
• Step D:
• using a preset laser cutting tool to perform cutting operations on said circuit board outside said marking points one by one;
• Step E:
• using a preset robot arm to take out said circuit board that has been cut with said marking point, so that a through hole is formed at each said marking point of said circuit board;
• Step F:
• using a second preset atomizer to spray a water-based environmentally friendly conductive paint on the surface of said circuit board, said water-based environmentally friendly conductive paint comprising a base material with a weight percentage of 20% to 50%, a binder with a weight percentage of 0.5%˜20%, a polymer material cross-linking agent with a weight percentage of 0.5%˜30% and a deionized water with a weight percentage of 10%˜30%, enabling said water-based environmentally friendly conductive paint to fill in said through hole, so that said water-based environmentally friendly conductive paint forms a conductive layer when solidified, said conductive layer forming an electrical connection with said copper foil layer inside said circuit board, for allowing electromagnetic waves, crosstalk, clutter and other interference generated by an operation of said electronic components can be guided by said conductive layer and said through holes to said copper foil layer inside said circuit board for elimination;
• and
• Step G:
• using said first preset atomizer to spray said water-based environmentally friendly paint on a surface of said conductive layer, said water-based environmentally friendly paint comprises a base material with a weight percentage of about 20% to 50%, a heat dissipation material with a weight percentage of about 10% to 40%, a polymer material cross-linking agent with a weight percentage of about 0.5% to 30% and a deionized water with a weight percentage of about 10% to 30%, and forms a second insulating layer on the surface of said conductive layer when said water-based environmentally friendly paint is solidified.