H05K 3/4061
For via connections in inorganic insulating substrates
Official title: {for via connections in inorganic insulating substrates}
H05K3/4061 (For via connections in inorganic insulating substrates) appears on 364 US grants and 291 published applications in this corpus.
Search patents in H05K- Granted patents
- 364
- Published applications
- 291
- Assignees
- 179
- Inventors
- 916
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 8 | 0 |
| 1993 | 4 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 12 | 0 |
| 1997 | 29 | 0 |
| 1998 | 12 | 0 |
| 1999 | 7 | 0 |
| 2000 | 11 | 0 |
| 2001 | 11 | 6 |
| 2002 | 11 | 12 |
| 2003 | 17 | 17 |
| 2004 | 15 | 23 |
| 2005 | 13 | 20 |
| 2006 | 8 | 14 |
| 2007 | 10 | 13 |
| 2008 | 10 | 10 |
| 2009 | 8 | 17 |
| 2010 | 8 | 23 |
| 2011 | 13 | 15 |
| 2012 | 15 | 10 |
| 2013 | 11 | 9 |
| 2014 | 8 | 10 |
| 2015 | 7 | 6 |
| 2016 | 9 | 3 |
| 2017 | 8 | 8 |
| 2018 | 5 | 13 |
| 2019 | 9 | 11 |
| 2020 | 7 | 16 |
| 2021 | 9 | 6 |
| 2022 | 6 | 3 |
| 2023 | 7 | 6 |
| 2024 | 4 | 3 |
| 2025 | 1 | 10 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board7 Jul 2026US 12,677,381 B2Avary Holding (Shenzhen) Co., Limited.
- Ion thruster and method for fabrication thereof10 Feb 2026US 12,546,295 B2
- Structure body and method of manufacturing the same25 Nov 2025US 12,484,146 B2Murata Manufacturing Co., Ltd.
- Methods of manufacturing circuit board and circuit board assembly13 Aug 2024US 12,063,752 B2Avary Holding (Shenzhen) Co., Limited.
- Double-sided circuit non-oxide-based ceramic substrate and method for manufacturing same2 Jul 2024US 12,028,984 B2Hitachi Power Solutions Co., Ltd.
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Electronic device and manufacturing method thereof25 Jun 2026US 2026/0181774 A1Innolux Corporation
- Electronic device and manufacturing method thereof12 Mar 2026US 2026/0075709 A1Panelsemi Corporation
- Ceramic circuit board, manufacturing method for ceramic circuit board, and brazing material for circuit formation5 Mar 2026US 2026/0068042 A1Proterial, Ltd.
- Microelectronic Packaging Using Circuits on Glass and Stacking Glass Circuits5 Feb 2026US 2026/0040463 A1Sciperio, Inc
Most cited
By later US patents
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Thick film and thin film composite substrate and electronic circuit apparatus using it137US 5,110,664 AHitachi, Ltd. · 1992
- Ceramic substrate for implantable medical devices125US 5,855,995 AMedtronic, Inc. · 1999
- Method of forming a microcircuit via interconnect117US 5,599,744 AGrumman Aerospace Corporation · 1997
- Multilayer substrate112US 7,297,627 B2Medtronic MiniMed, Inc. · 2007