Structure body and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsMinoru Hatase, Yoshihito Otsubo
Life of this patent
Estimating the term…
Abstract
A structure body includes a ceramic substrate including a first surface, a first conductor pattern arranged on the first surface, and a first columnar conductor connected to the first conductor pattern and extending in a direction of thickness in an orientation away from the ceramic substrate. The first columnar conductor is provided with a recess in an end surface on a side close to the ceramic substrate and the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.
Claims20
A structure body comprising:
- a ceramic substrate including a first surface;
- a first conductor pattern arranged on the first surface;
- and
- a first columnar conductor connected to the first conductor pattern and extending in a direction of thickness in an orientation away from the ceramic substrate, wherein
- the first columnar conductor is provided with a recess in an end surface on a side closer to the ceramic substrate, and
- the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.
A structure body comprising:
- a ceramic substrate including a first surface;
- and
- a first columnar conductor connected to the first surface and extending in a direction of thickness in an orientation away from the ceramic substrate, wherein
- the ceramic substrate includes a conductor via extending in a direction of thickness as being exposed at the first surface,
- the first columnar conductor is connected to the conductor via,
- the first columnar conductor is provided with a recess in an end surface on a side closer to the ceramic substrate, and
- the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.
A method of manufacturing a structure body, the method comprising:
- providing a through hole in a sacrificial sheet not sintered in a temperature range where a ceramic component of a ceramic green sheet is sintered;
- filling the through hole with a conductive paste;
- preparing a first multilayer body being a multilayer body of ceramic green sheets, the first multilayer body including a first surface;
- obtaining a second multilayer body by layering the sacrificial sheet on the first surface of the first multilayer body;
- firing the second multilayer body;
- and
- removing the sacrificial sheet from the second multilayer body to leave a first columnar conductor generated by firing of the conductive paste, wherein
- after the firing of the second multilayer body, the first columnar conductor is provided with a recess in an end surface on a side closer to a ceramic substrate formed by firing of the first multilayer body, and
- the first surface is provided with a raised portion in conformity with the recess in a region where the first columnar conductor is superimposed.
Dependencies are inferred from the claim text.