Electronic device and manufacturing method thereof

A manufacturing method for an electronic device, comprising:

• forming a single-sided structure assembly;
• wherein the single-sided structure assembly includes:
• a core substrate, having a through hole penetrating two surfaces thereof;
• defining a projection direction perpendicular to one surface of the core substrate;
• a conductive layer structure, stacking over one side of the core substrate, and covering at least a part of the through hole;
• and
• an adhesive pattern layer, locating between the conductive layer structure and the core substrate, and bonding the conductive layer structure and the core substrate;
• wherein the adhesive pattern layer has an opening window, the opening window exposes at least a part of the conductive layer structure;
• wherein the through hole and the opening window at least partially overlap in the projection direction;
• and
• arranging a conductive member in the single-sided structure assembly and further including:
• arranging a conductive material in the through hole of the core substrate;
• and providing a thermal curing process to the conductive material to form the conductive member;
• wherein one end of the conductive member is electrically connected to the conductive layer structure through the opening window.

A manufacturing method for an electronic device, comprising:

• forming a single-sided structure assembly;
• wherein the single-sided structure assembly includes:
• a core substrate, having a through hole penetrating its two surfaces;
• defining a projection direction perpendicular to one surface of the core substrate;
• a conductive layer structure, stacked over one side of the core substrate, and the conductive layer structure covers at least a part of the through hole;
• and
• an adhesive pattern layer, located between the conductive layer structure and the core substrate, and bonding the conductive layer structure and the core substrate;
• the adhesive pattern layer having an opening window that exposes at least a part of the conductive layer structure;
• wherein the through hole and the opening window overlap at least partially in the projection direction;
• arranging a conductive material in the through hole of the core substrate;
• arranging an associate structure on the other side of the core substrate;
• wherein the associate structure includes an associate adhesive pattern layer and the associate conductive layer structure, the associate conductive layer structure is connected to the associate adhesive pattern layer and is located on the opposite side of the associate adhesive pattern layer from the core substrate;
• the associate adhesive pattern layer has an opening window, the opening window of the associate adhesive pattern layer exposes at least a part of the associate conductive layer structure, and the associate conductive layer structure covers at least a part of the through hole;
• and
• thermally curing the conductive material to form the conductive component;
• wherein one end of the conductive component electrically connects to the conductive layer structure through the opening window of the adhesive pattern layer, and the other end of the conductive component electrically connects to the associate conductive layer structure through the opening window of the associate adhesive pattern layer.

A manufacturing method for an electronic device, comprising:

• providing an undefined initial substrate;
• stacking an adhesive structure and an associate adhesive structure on opposite sides of the initial substrate;
• wherein the adhesive structure and the associate adhesive structure each include an undefined adhesive layer and a release layer;
• wherein the adhesive layer is between the release layer and the initial substrate;
• performing a through hole process on the initial substrate and its bonded adhesive structure and associate adhesive structure;
• wherein the initial substrate defines a through hole forming a core substrate;
• the adhesive structure and the associate adhesive structure each define an opening window to form an adhesive pattern layer and an associate adhesive pattern layer respectively;
• removing the release layer of the adhesive structure;
• attaching a conductive layer structure to the adhesive pattern layer, the conductive layer structure covering at least a part of the corresponding through hole;
• arranging a conductive material in the through hole;
• removing the release layer of the associate adhesive structure;
• arranging an associate conductive layer structure on the associate adhesive pattern layer;
• and
• thermally curing the conductive material to form a conductive component;
• the conductive component passes through the corresponding opening areas and is electrically connected at both ends to the conductive layer structure and the associate conductive layer structure.