Method of forming a microcircuit via interconnect
AssigneeGrumman Aerospace Corporation
InventorsWei H. Koh, Connie S. McCausland
Life of this patent
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Abstract
A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.
Claims22
A method for forming a conductive via in a non-conductive substrate having a through-hole formed intermediate two sides of the substrate, a thin conductive film being formed upon the substrate, the method comprising the steps of:
- a) applying a conductive material within the through-hole;
- b) firing the conductive material at a temperature below that temperature which results in degradation of the thin conductive film;
- c) coating the through-hole within the conductive material;
- d) applying a first non-conductive material to the conductive material;
- and
- e) applying a second non-conductive material to the first-non-conductive material so as to fill the through-hole.
A method for forming a conductive via in a non-conductive substrate, a through-hold formed intermediate two sides of the substrate, either a thick conductive film or no conductive film being formed upon the substrate, the method comprising the steps of:
- a) applying a conductive material within the through-hole to coat the through-hole with a conductive material;
- b) firing the conductive material at a temperature sufficient to effect full firing thereof;
- c) applying a first non-conductive material to the conductive material;
- and
- d) applying a second non-conductive material to the first non-conductive material so as to fill the through-hole.
Dependencies are inferred from the claim text.