H05K 3/4069
For via connections in organic insulating substrates
Official title: {for via connections in organic insulating substrates}
H05K3/4069 (For via connections in organic insulating substrates) appears on 938 US grants and 940 published applications in this corpus.
Search patents in H05K- Granted patents
- 938
- Published applications
- 940
- Assignees
- 353
- Inventors
- 1,795
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 13 | 0 |
| 1994 | 10 | 0 |
| 1995 | 16 | 0 |
| 1996 | 15 | 0 |
| 1997 | 18 | 0 |
| 1998 | 21 | 0 |
| 1999 | 26 | 0 |
| 2000 | 29 | 0 |
| 2001 | 27 | 28 |
| 2002 | 43 | 88 |
| 2003 | 54 | 61 |
| 2004 | 65 | 81 |
| 2005 | 54 | 58 |
| 2006 | 44 | 54 |
| 2007 | 42 | 53 |
| 2008 | 35 | 68 |
| 2009 | 19 | 68 |
| 2010 | 34 | 38 |
| 2011 | 33 | 35 |
| 2012 | 40 | 40 |
| 2013 | 41 | 35 |
| 2014 | 22 | 26 |
| 2015 | 17 | 16 |
| 2016 | 17 | 19 |
| 2017 | 15 | 15 |
| 2018 | 15 | 18 |
| 2019 | 27 | 24 |
| 2020 | 20 | 23 |
| 2021 | 15 | 21 |
| 2022 | 20 | 25 |
| 2023 | 16 | 16 |
| 2024 | 17 | 10 |
| 2025 | 9 | 13 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof23 Jun 2026US 12,666,546 B2Fict Limited
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Circuit board arrangement comprising a circuit board provided with a graphene island and method of communicating between a first and a second circuit24 Mar 2026US 12,588,141 B2Telefonaktiebolaget Ericsson LM (publ)
- Method for manufacturing circuit board6 Jan 2026US 12,520,423 B2Fict Limited
- Low cost, low loss material for microwave or antenna printed circuit board1 Jul 2025US 12,347,927 B2Hughes Network Systems, LLC
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Printed wiring board16 Jul 2026US 2026/0206136 A1Fujikura Ltd.
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Multilayer circuit board29 Jan 2026US 2026/0032809 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- High-density electronic package, and method for making same437US 6,376,769 B1Amerasia International Technology, Inc. · 2002
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Tamper-resistant wireless article including an antenna310US 6,421,013 B1Amerasia International Technology, Inc. · 2002
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995