Circuit board with a plurality of laminated insulating layers having conductive paste filled vias and manufacturing method thereof

A circuit board comprising:

• a plurality of first insulating base materials and a plurality of second insulating base materials that are alternately laminated;
• a first metal layer being formed into a pattern shape on a first surface of the first insulating base material;
• a second metal layer being formed into a pattern shape on a second surface of the first insulating base material;
• a first conductive paste being filled into a through hole of the first insulating base material so as to connect the first metal layer and the second metal layer;
• and
• a second conductive paste being filled into a through hole of the second insulating base material so as to connect the second metal layer of the first insulating base material that is laminated on a first surface side of the second insulating base material, and the first metal layer of the first insulating base material that is laminated on a second surface side of the second insulating base material,
• the first metal layer being formed into a trapezoidal shape that is large in diameter on the first surface side of the first insulating base material,
• the second metal layer being formed into a trapezoidal shape that is large in diameter on the second surface side of the first insulating base material,
• the first metal layers and the second metal layers being laminated in such a manner that the trapezoidal shapes are alternately oriented,
• characterized in that the second metal layer of the first insulating base material that is laminated on the first surface side of the second insulating base material, is embedded in the first surface of the second insulating base material, and
• the first metal layer of the first insulating base material that is laminated on the second surface side of the second insulating base material, is embedded in the second surface of the second insulating base material.