H05K 3/4046
Using auxiliary conductive elements
Official title: {using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire}
H05K3/4046 (Using auxiliary conductive elements) appears on 469 US grants and 518 published applications in this corpus.
Search patents in H05K- Granted patents
- 469
- Published applications
- 518
- Assignees
- 297
- Inventors
- 1,033
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 5 | 0 |
| 1978 | 9 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 8 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 8 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 10 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 0 |
| 2002 | 10 | 14 |
| 2003 | 17 | 10 |
| 2004 | 16 | 22 |
| 2005 | 14 | 17 |
| 2006 | 12 | 21 |
| 2007 | 14 | 25 |
| 2008 | 7 | 23 |
| 2009 | 10 | 24 |
| 2010 | 19 | 13 |
| 2011 | 22 | 26 |
| 2012 | 16 | 22 |
| 2013 | 17 | 27 |
| 2014 | 19 | 26 |
| 2015 | 12 | 18 |
| 2016 | 19 | 11 |
| 2017 | 14 | 12 |
| 2018 | 17 | 11 |
| 2019 | 16 | 23 |
| 2020 | 10 | 19 |
| 2021 | 18 | 19 |
| 2022 | 9 | 13 |
| 2023 | 7 | 9 |
| 2024 | 14 | 9 |
| 2025 | 11 | 9 |
| 2026 | 3 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
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- BGA package using PCB and tape in a die-up configuration171US 6,069,407 AVLSI Technology, Inc. · 2000
- Methods of fabrication of coaxial vias and magnetic devices167US 5,898,991 AInternational Business Machines Corporation · 1999