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US 12,568,576 B2Granted
Stud bumped printed circuit assembly
OwnerJames Rathburninventor
Life of this patent
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Abstract
A circuit board having a plurality of conductive layers including a first conductive layer and a second conductive layer is provided. The circuit board includes a plurality of non-conductive layers in-between respective conductive layers of the plurality of conductive layers. The plurality of non-conductive layers include at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer. At least one collapsed stud bump extends at least partially through the first non-conductive layer to electrically couple the first conductive layer to the second conductive layer.
Claims6
A circuit board comprising:
- a plurality of conductive layers including a first conductive layer and a second conductive layer;
- a plurality of non-conductive layers in-between respective conductive layers of the plurality of conductive layers, the plurality of non-conductive layers including at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer;
- at least one collapsed stud bump extending at least partially through the first non-conductive layer to electrically couple the first conductive layer to the second conductive layer;
- and
- a surface finish layer on the first conductive layer, between the at least one collapsed stud bump and the first conductive layer, the surface finish layer composed of one or more noble metals,
- wherein the at least one collapsed stud bump is bonded to the surface finish layer and is in non-bonded contact with the second conductive layer.
3 more elements
Dependencies are inferred from the claim text.