Attachment assembly for integrated circuits

An assembly to attach an integrated circuit to a top surface of a circuit board and to a heat sink disposed beneath a bottom surface of the circuit board, the assembly comprising:

• (a) an integrated circuit die;
• (b) a package including laminate means having a die attach cavity formed therethrough for holding the integrated circuit die and electrical connection means for coupling the integrated circuit die to an arrangement of pins on a bottom of the package;
• (c) heat spreader means for thermally spreading heat generated by the integrated circuit die, coupled to the bottom of the package and having a surface area at least as large as the die attach cavity, the integrated circuit die being attached to the heat spreader within the die attach cavity;
• and,
• (d) thermally conductive slug means, coupled to the heat spreader means and adapted to span through an opening formed in the circuit board, for thermally interfacing the integrated circuit die to the heat sink.

A method of attaching an integrated circuit to a circuit board top and to a heat sink disposed below the circuit board bottom, comprising steps of:

• (a) mounting an integrated circuit die within a die attach cavity formed through a planar material to a heat spreader attached to the bottom of the planar material, the heat spreader having a surface area at least as large as the die attach cavity;
• (b) bonding the integrated circuit die to a plurality of electrical traces formed on the planar material and coupling the electrical traces to an arrangement of pins formed on a bottom of the planar material;
• and,
• (c) thermally coupling the integrated circuit die with the heat spreader through an opening formed in the circuit board to the heat sink disposed below the circuit board bottom.

In a low profile product having a circuit board and a heat sink disposed below the circuit board bottom, an assembly to attach an integrated circuit to the circuit board top and to the heat sink, comprising:

• (a) an integrated circuit die;
• (b) a package including a planar material having a top, a bottom, a die attach cavity being formed therethrough for receiving the integrated circuit die, and a plurality of electrical traces being formed on the bottom, the electrical traces being coupled to an arrangement of pins on the bottom and to the integrated circuit die;
• (c) a heat spreader attached to the bottom of the package having a surface area at least as large as the die attach cavity, the integrated circuit die being attached within the die attach cavity to the heat spreader;
• and,
• (d) a thermally conductive slug coupled to the heat spreader and adapted to pass through an opening formed in the circuit board and couple to the heat sink disposed below the circuit board bottom.