Back to results
US 12,471,219 B2Granted
Electronic device comprising surface-mount device type dipoles, and corresponding assembly method
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorPierino Calascibetta
Life of this patent
Estimating the term…
Abstract
A base substrate has a thickness between two faces. The base substrate includes at least one hole extending in a thickness of the base substrate perpendicular to one of the two faces. At least one dipole of a surface-mount device type is housed in the at least one hole of the base substrate.
Claims31
A method, comprising:
- forming a hole extending in a thickness of a base substrate;
- inserting at least one dipole of a surface-mount device type in the hole;
- wherein said at least one dipole of the surface-mount device type includes electrical terminations;
- mounting an integrated circuit chip including an electrical chip connection element on a front face of the base substrate;
- and
- securing the at least one dipole of the surface-mount device type within the hole using a volume of conductive adhesive;
- wherein said volume of conductive adhesive physically contacts both said at least one electrical termination of the at least one dipole of the surface-mount device type and the electrical chip connection element of the integrated circuit chip.
4 more elements
A method, comprising:
- forming a hole extending in a thickness of a base substrate;
- inserting at least one dipole of a surface-mount device type in the hole;
- wherein said at least one dipole of the surface-mount device type includes electrical terminations;
- securing the at least one dipole of the surface-mount device type within the hole using a volume of conductive adhesive;
- forming a solder mask layer on a front face of the base substrate;
- wherein said solder mask layer completely covers the hole;
- mounting an integrated circuit chip to the solder mask at the front face of the base substrate;
- wherein said volume of conductive adhesive forms at least part of an electrical connection between at least one electrical termination of the at least one dipole of the surface-mount device type and the integrated circuit chip.
5 more elements
A method, comprising:
- forming a hole extending in a thickness of a base substrate;
- inserting a first dipole of a surface-mount device type in the hole;
- placing a volume of conductive adhesive within the hole;
- inserting a second dipole of a surface-mount device type in the hole;
- wherein the volume of conductive adhesive electrically connects adjacent electrical terminations of the first and second dipoles of the surface-mount device type within the hole;
- securing one or more of the first and second dipoles of the surface-mount device type within the hole using a further volume of conductive adhesive;
- and
- mounting an integrated circuit chip on a front face of the base substrate;
- wherein said further volume of conductive adhesive forms at least part of an electrical connection between said one or more of the first and second dipoles of the surface-mount device type and the integrated circuit chip.
6 more elements
Dependencies are inferred from the claim text.