H05K 3/403
Edge contacts
Official title: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)}
H05K3/403 (Edge contacts) appears on 846 US grants and 689 published applications in this corpus.
Search patents in H05K- Granted patents
- 846
- Published applications
- 689
- Assignees
- 451
- Inventors
- 1,946
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 5 | 0 |
| 1981 | 8 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 7 | 0 |
| 1985 | 10 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 13 | 0 |
| 1991 | 10 | 0 |
| 1992 | 8 | 0 |
| 1993 | 8 | 0 |
| 1994 | 11 | 0 |
| 1995 | 17 | 0 |
| 1996 | 10 | 0 |
| 1997 | 24 | 0 |
| 1998 | 19 | 0 |
| 1999 | 25 | 0 |
| 2000 | 25 | 0 |
| 2001 | 29 | 9 |
| 2002 | 28 | 34 |
| 2003 | 41 | 54 |
| 2004 | 47 | 43 |
| 2005 | 23 | 40 |
| 2006 | 25 | 46 |
| 2007 | 30 | 44 |
| 2008 | 23 | 35 |
| 2009 | 22 | 35 |
| 2010 | 32 | 32 |
| 2011 | 17 | 25 |
| 2012 | 25 | 9 |
| 2013 | 20 | 17 |
| 2014 | 8 | 19 |
| 2015 | 24 | 30 |
| 2016 | 20 | 22 |
| 2017 | 29 | 17 |
| 2018 | 18 | 19 |
| 2019 | 20 | 32 |
| 2020 | 25 | 27 |
| 2021 | 30 | 21 |
| 2022 | 21 | 25 |
| 2023 | 13 | 15 |
| 2024 | 16 | 17 |
| 2025 | 17 | 10 |
| 2026 | 4 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Circuit board having an edge containing conductive regions2 Jun 2026US 12,648,082 B2Teradyne, Inc.
- Display device using micro LED and modular display device using same31 Mar 2026US 12,593,551 B2LG Electronics Inc.
- Cavity based power delivery and decoupling3 Feb 2026US 12,543,274 B2Cisco Technology, Inc.
- Circuit board11 Nov 2025US 12,471,214 B2AUO Corporation
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Wiring board, electronic component mounting substrate including wiring board, and electronic module6 Aug 2026US 2026/0231323 A1KYOCERA Corporation
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Method for manufacturing wiring substrate, and wiring substrate2 Jul 2026US 2026/0190243 A1Ibiden Co., Ltd.
- Array printed circuit board, and printed circuit board and manufacturing method of the same4 Jun 2026US 2026/0156740 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Busbars for electrically powered cells445US 6,317,248 B1Donnelly Corporation · 2001
- Busbars for electrically powered cells408US 6,449,082 B1Donnelly Corporation · 2002
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001