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US 12,543,274 B2Granted
Cavity based power delivery and decoupling
AssigneeCisco Technology, Inc.
InventorsMike Sapozhnikov, Sayed Ashraf Mamun, D. Brice Achkir, David Nozadze, Amendra Koul, Upen Reddy Kareti
Life of this patent
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Abstract
The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.
Claims20
An apparatus comprising:
- a support structure of an integrated circuit device;
- and
- an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity that defines a vertical plating plane that is plated with a conductive material, the conductive material plated on the vertical plating plane defined on the interior of the elongated cavity being separated into at least a first power connection portion and a first ground connection portion by a plurality of bores.
An apparatus comprising:
- a first circuit board in which an elongated cavity is formed, wherein an interior of the elongated cavity is plated with a conductive material separated into a female power connection portion and a female ground connection portion;
- and
- a second circuit board on which a connector is formed, wherein the connector protrudes from the second circuit board and includes a male power connection portion, a male ground connection portion and an insulating material arranged between the male power connection portion and the male ground connection portion,
- wherein the connector is arranged within the elongated cavity to secure the first circuit board to the second circuit board and forms a first electrical connection between the female power connection portion and the male power connection portion and a second electrical connection between the female ground connection portion and the male ground connection portion.
1 more element
A method comprising:
- forming an elongated cavity in a support structure of an integrated circuit device;
- plating an interior of the elongated cavity with a conductive material, the interior including a vertical plating plane, wherein plating the interior of the elongated cavity with the conductive material includes plating the vertical plating plane;
- and
- forming a first bore and a second bore in the conductive material plated on the vertical plating plane to separate the conductive material into a first power connection portion and a first ground connection portion, wherein forming the first bore in the conductive material plated on the vertical plating plane removes the conductive material from between the first power connection portion and the first ground connection portion.
1 more element
Dependencies are inferred from the claim text.