Array printed circuit board, and printed circuit board and manufacturing method of the same

A printed circuit board, comprising:

• a stacking structure that includes an insulation layer and wiring, wherein the wiring comprises a plurality of wiring layers;
• and
• a separation hole configured to separate at least one wiring layer of the plurality of wiring layers,
• wherein the wiring comprises dummy wiring between an edge of the stacking structure and a first side of the separation hole adjacent to the edge of the stacking structure.

A manufacturing method of a printed circuit board, comprising:

• forming an array printed circuit board, wherein the array printed circuit board comprises
• a plurality of substrate regions in which a plurality of printed circuit boards are disposed, respectively,
• a peripheral region configured to connect the plurality of substrate regions,
• a test pad in the peripheral region, and
• connection wiring that electrically connects the test pad and at least one substrate region of the plurality of substrate regions;
• testing the array printed circuit board using the test pad and the connection wiring;
• forming a separation hole;
• and
• cutting the array printed circuit board,
• wherein the separation hole is configured to disconnect the connection wiring from wiring in the at least one substrate region.