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US 6,824,665 B2Granted
Seed layer deposition
AssigneeShipley Company, L.L.C.
InventorsJames G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
Life of this patent
Estimating the term…
Abstract
Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
Claims14
A method for manufacturing an integrated circuit comprising the steps of:
- providing an integrated circuit substrate comprising a discontinuous copper seed layer, a conductive layer and apertures of <1 μm;
- contacting the integrated circuit substrate with an electroless copper plating bath;
- subjecting the electronic device substrate to a low current density for a period of time to initiate plating of copper on the conductive layer;
- discontinuing the current;
- and continuing to plate electrolessly to provide a substantially continuous copper seed layer;
- wherein the electroless copper plating bath consists of a soluble form of copper ions, one or more reducing agents, water, one or more bases, optionally one or more complexing agents, and optionally one or more organic solvents.
3 more elements
A method of enhancing a discontinuous seed layer disposed on an integrated circuit substrate comprising the steps of:
- contacting a substrate having a conductive layer, a discontinuous copper seed layer and apertures of <1 μm with an electroless copper plating bath;
- subjecting the substrate to a low current density for a period of time to initiate plating of copper on the conductive layer;
- discontinuing the current;
- and continuing to plate electrolessly to provide a substantially continuous copper seed layer, wherein the electroless copper plating bath consists of a soluble form of copper ions, one or more reducing agents, water, one or more bases, optionally one or more complexing agents, and optionally one or more organic solvents.
1 more element
Dependencies are inferred from the claim text.