H05K 3/4007
Surface contacts
Official title: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
H05K3/4007 (Surface contacts) appears on 2,087 US grants and 2,024 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,087
- Published applications
- 2,024
- Assignees
- 704
- Inventors
- 3,825
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 7 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 8 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 12 | 0 |
| 1991 | 14 | 0 |
| 1992 | 23 | 0 |
| 1993 | 25 | 0 |
| 1994 | 28 | 0 |
| 1995 | 23 | 0 |
| 1996 | 29 | 0 |
| 1997 | 26 | 0 |
| 1998 | 57 | 0 |
| 1999 | 58 | 0 |
| 2000 | 61 | 0 |
| 2001 | 68 | 36 |
| 2002 | 54 | 62 |
| 2003 | 57 | 49 |
| 2004 | 50 | 55 |
| 2005 | 38 | 68 |
| 2006 | 52 | 65 |
| 2007 | 51 | 107 |
| 2008 | 59 | 111 |
| 2009 | 54 | 101 |
| 2010 | 58 | 69 |
| 2011 | 62 | 68 |
| 2012 | 69 | 72 |
| 2013 | 61 | 82 |
| 2014 | 54 | 106 |
| 2015 | 75 | 124 |
| 2016 | 101 | 96 |
| 2017 | 102 | 118 |
| 2018 | 96 | 93 |
| 2019 | 89 | 83 |
| 2020 | 88 | 94 |
| 2021 | 77 | 89 |
| 2022 | 74 | 77 |
| 2023 | 57 | 62 |
| 2024 | 55 | 64 |
| 2025 | 44 | 45 |
| 2026 | 20 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board structure and manufacturing method thereof6 Oct 2026US 12,757,334 B2Unimicron Technology Corp.
- Flexible interconnect circuits comprising welded connections25 Aug 2026US 12,720,679 B2CelLink Corporation
- Stackable memory module with double-sided compression contact pads11 Aug 2026US 12,707,566 B2Intel Corporation
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Wiring substrate and method for manufacturing wiring substrate8 Oct 2026US 2026/0313802 A1Ibiden Co., Ltd.
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Component carrier with stacked electrically conductive layers, embedded and on the surface17 Sep 2026US 2026/0282223 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board, and semiconductor package comprising same20 Aug 2026US 2026/0247530 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Hermetically sealed electrical feedthrough for use with implantable electronic devices698US 5,750,926 AAlfred E. Mann Foundation for Scientific Research · 1998
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993