H05K 3/4015
Using auxiliary conductive elements
Official title: {using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres}
H05K3/4015 (Using auxiliary conductive elements) appears on 580 US grants and 502 published applications in this corpus.
Search patents in H05K- Granted patents
- 580
- Published applications
- 502
- Assignees
- 315
- Inventors
- 1,164
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 17 | 0 |
| 1999 | 22 | 0 |
| 2000 | 26 | 0 |
| 2001 | 27 | 16 |
| 2002 | 16 | 21 |
| 2003 | 20 | 21 |
| 2004 | 22 | 13 |
| 2005 | 7 | 14 |
| 2006 | 15 | 12 |
| 2007 | 11 | 29 |
| 2008 | 15 | 25 |
| 2009 | 18 | 29 |
| 2010 | 12 | 13 |
| 2011 | 18 | 10 |
| 2012 | 13 | 19 |
| 2013 | 14 | 22 |
| 2014 | 13 | 28 |
| 2015 | 15 | 30 |
| 2016 | 29 | 23 |
| 2017 | 38 | 31 |
| 2018 | 19 | 20 |
| 2019 | 23 | 29 |
| 2020 | 22 | 22 |
| 2021 | 18 | 28 |
| 2022 | 18 | 16 |
| 2023 | 15 | 14 |
| 2024 | 14 | 8 |
| 2025 | 6 | 5 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Flexible interconnect circuits comprising welded connections25 Aug 2026US 12,720,679 B2CelLink Corporation
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Optoelectronic component, network device, and method for manufacturing optoelectronic component5 May 2026US 12,620,734 B2Huawei Technologies Co., Ltd.
- Printed circuit board with a contact point7 Apr 2026US 12,597,750 B2KNORR-BREMSE Systeme fuer Nutzfahrzeuge GmbH
- Circuit-board-and-connector assembly and a method of producing thereof10 Feb 2026US 12,548,928 B2AUMOVIO Germany GmbH
- Flexible Interconnect Circuits Comprising Welded Connections11 Jun 2026US 2026/0164551 A1CelLink Corporation
- Package substrate and fabricating method thereof26 Feb 2026US 2026/0059658 A1AaltoSemi Inc.
- Self-configuring contact arrays for interfacing with electric circuits and fabric carriers19 Feb 2026US 2026/0053035 A1University of Louisville Research Foundation, Inc.
- Wire-wound charger, rotating electrical connection structure thereof, and formation method thereof12 Feb 2026US 2026/0045749 A1Shenzhen Shounuoxin Electronics Co., Ltd
- Flexible printed circuit board, display device comprising the same, method for manufacturing the same, and electronic device comprising the same25 Dec 2025US 2025/0393125 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002