Optoelectronic component, network device, and method for manufacturing optoelectronic component
AssigneeHuawei Technologies Co., Ltd.
InventorYing Guo
Life of this patent
Estimating the term…
Abstract
An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.
Claims20
An optoelectronic component comprising:
- a host circuit board comprising:
- a first host circuit board surface;
- and
- a conductive sheet located on the first host circuit board surface;
- an optical module comprising:
- a first end;
- a second end;
- a module circuit board located on the host circuit board and comprising:
- a first module circuit board surface, wherein the first module circuit board surface faces the first host circuit board surface;
- and
- a second module circuit board surface;
- a gold finger in contact with the conductive sheet, wherein the gold finger is located on the first module circuit board surface;
- and
- an air duct located between and passing through the first end and the second end;
- and
- a heat sink located on the second module circuit board surface.
A network device comprising:
- an optoelectronic component comprising:
- a host circuit board comprising:
- a first host circuit board surface;
- and
- a conductive sheet located on the first host circuit board surface;
- an optical module comprising:
- a first end;
- a second end;
- a module circuit board located on the host circuit board and comprising:
- a first module circuit board surface, wherein the first module circuit board surface faces the first host circuit board surface;
- and
- a second module circuit board surface;
- a gold finger in contact with the conductive sheet, wherein the gold finger is located on the first module circuit board surface;
- and
- an air duct located between and passing through the first end and the second end;
- and
- a heat sink located on the second module circuit board surface.
A method for manufacturing an optoelectronic component and comprising:
- installing a gold finger on a first module circuit board surface of a module circuit board of an optical module that extends from a first end to a second end;
- installing a heat sink on a second module circuit board surface of the module circuit board;
- installing a conductive sheet on a first host circuit board surface of a host circuit board;
- installing the optical module on the first host circuit board surface so that the first module circuit board surface faces the first host circuit board surface, and so that the gold finger is in contact with the conductive sheet;
- and
- disposing an air duct on the optical module so that the air duct is located between and passes through a first end of the optical module and a second end of the optical module.
Dependencies are inferred from the claim text.