H05K 3/42
Plated through-holes or plated via connections
Official title: Plated through-holes {or plated via connections}
H05K3/42 (Plated through-holes or plated via connections) appears on 4,139 US grants and 4,056 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,139
- Published applications
- 4,056
- Assignees
- 1,128
- Inventors
- 7,409
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 16 | 0 |
| 1982 | 10 | 0 |
| 1983 | 16 | 0 |
| 1984 | 15 | 0 |
| 1985 | 29 | 0 |
| 1986 | 41 | 0 |
| 1987 | 33 | 0 |
| 1988 | 40 | 0 |
| 1989 | 44 | 0 |
| 1990 | 54 | 0 |
| 1991 | 52 | 0 |
| 1992 | 40 | 0 |
| 1993 | 44 | 0 |
| 1994 | 55 | 0 |
| 1995 | 59 | 0 |
| 1996 | 68 | 0 |
| 1997 | 60 | 0 |
| 1998 | 97 | 0 |
| 1999 | 81 | 0 |
| 2000 | 88 | 0 |
| 2001 | 100 | 56 |
| 2002 | 119 | 122 |
| 2003 | 112 | 129 |
| 2004 | 143 | 175 |
| 2005 | 84 | 171 |
| 2006 | 113 | 240 |
| 2007 | 110 | 221 |
| 2008 | 133 | 212 |
| 2009 | 118 | 234 |
| 2010 | 159 | 190 |
| 2011 | 135 | 147 |
| 2012 | 181 | 145 |
| 2013 | 112 | 128 |
| 2014 | 91 | 135 |
| 2015 | 112 | 159 |
| 2016 | 139 | 174 |
| 2017 | 166 | 150 |
| 2018 | 139 | 144 |
| 2019 | 145 | 144 |
| 2020 | 140 | 167 |
| 2021 | 137 | 123 |
| 2022 | 120 | 153 |
| 2023 | 100 | 136 |
| 2024 | 105 | 119 |
| 2025 | 88 | 105 |
| 2026 | 59 | 177 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/429Plated through-holes specially for multilayer circuits1,650
- H05K 3/425Characterised by the sequence of steps for plating the through-holes or via1,098
- H05K 3/423Characterised by electroplating method963
- H05K 3/421Blind plated via connections410
- H05K 3/422Characterised by electroless plating method262
Recent patents
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Mating backplane for high speed, high density electrical connector25 Aug 2026US 12,720,680 B2Amphenol Corporation
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Multi-layer circuit board and processing method therefor, chip system, and electronic device24 Sep 2026US 2026/0293001 A1Huawei Technologies Co., Ltd.
- Circuit board and manufacturing method thereof10 Sep 2026US 2026/0271188 A1Samsung Electro-Mechanics Co., Ltd.
- Device including board member and manufacturing methods27 Aug 2026US 2026/0255481 A1
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece440US 6,197,181 B1Semitool, Inc. · 2001
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998