H05K 3/429
Plated through-holes specially for multilayer circuits
Official title: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}
H05K3/429 (Plated through-holes specially for multilayer circuits) appears on 1,650 US grants and 1,639 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,650
- Published applications
- 1,639
- Assignees
- 600
- Inventors
- 3,249
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 15 | 0 |
| 1986 | 12 | 0 |
| 1987 | 13 | 0 |
| 1988 | 10 | 0 |
| 1989 | 14 | 0 |
| 1990 | 13 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 12 | 0 |
| 1994 | 16 | 0 |
| 1995 | 22 | 0 |
| 1996 | 17 | 0 |
| 1997 | 15 | 0 |
| 1998 | 36 | 0 |
| 1999 | 27 | 0 |
| 2000 | 37 | 0 |
| 2001 | 42 | 25 |
| 2002 | 52 | 50 |
| 2003 | 49 | 49 |
| 2004 | 64 | 79 |
| 2005 | 29 | 64 |
| 2006 | 59 | 103 |
| 2007 | 46 | 104 |
| 2008 | 75 | 103 |
| 2009 | 53 | 91 |
| 2010 | 70 | 74 |
| 2011 | 56 | 49 |
| 2012 | 66 | 45 |
| 2013 | 40 | 32 |
| 2014 | 27 | 43 |
| 2015 | 38 | 59 |
| 2016 | 42 | 62 |
| 2017 | 65 | 66 |
| 2018 | 59 | 65 |
| 2019 | 75 | 69 |
| 2020 | 71 | 68 |
| 2021 | 59 | 58 |
| 2022 | 55 | 68 |
| 2023 | 43 | 67 |
| 2024 | 49 | 50 |
| 2025 | 40 | 58 |
| 2026 | 27 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method thereof29 Sep 2026US 12,750,953 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring circuit board having a conductive layer with a via portion15 Sep 2026US 12,739,981 B2Nitto Denko Corporation
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Mating backplane for high speed, high density electrical connector25 Aug 2026US 12,720,680 B2Amphenol Corporation
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Multilayer circuit board with embedded module30 Jul 2026US 2026/0223296 A1Avary Holding (Shenzhen) Co., Limited.
- Substrate and method of manufacturing the same23 Jul 2026US 2026/0214799 A1Chipbond Technology Corporation
- Circuit board and manufacturing method thereof23 Jul 2026US 2026/0214800 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Semiconductor device and semiconductor device unit having ball-grid-array type package structure437US 5,726,493 AFujitsu Limited · 1998
- Electrical connector having triad contact groups arranged in an alternating inverted sequence316US 6,350,134 B1Tyco Electronics Corporation · 2002
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996