Multilayer circuit board with embedded module

A multilayer circuit board, comprising:

• an inner circuit substrate comprising a first surface, a second surface opposite to the first surface, and defining a through hole penetrating the first surface and the second surface;
• an electronic module accommodated in the through hole, the electronic module comprising a main body, at least one electronic component, a first adhesive layer, and a second adhesive layer, wherein the main body defines a groove on a surface of the main body, the at least one electronic component is fixed to a bottom wall of the groove through the first adhesive layer, the second adhesive layer infills the groove, and the first adhesive layer and the second adhesive layer jointly encapsulate the at least one electronic component;
• a first circuit substrate comprising a first substrate covering the first surface and a first conductive wiring layer laminated on the first substrate;
• and
• a second circuit substrate comprising a second substrate covering the second surface and a second conductive wiring layer laminated on the second substrate, wherein the first substrate and the second substrate jointly encapsulate the at least one electronic module.