H05K 3/422
Characterised by electroless plating method
Official title: {characterised by electroless plating method; pretreatment therefor}
H05K3/422 (Characterised by electroless plating method) appears on 262 US grants and 261 published applications in this corpus.
Search patents in H05K- Granted patents
- 262
- Published applications
- 261
- Assignees
- 129
- Inventors
- 622
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 3 | 5 |
| 2003 | 5 | 2 |
| 2004 | 4 | 4 |
| 2005 | 2 | 5 |
| 2006 | 2 | 13 |
| 2007 | 4 | 5 |
| 2008 | 5 | 8 |
| 2009 | 3 | 9 |
| 2010 | 4 | 10 |
| 2011 | 4 | 5 |
| 2012 | 12 | 8 |
| 2013 | 4 | 6 |
| 2014 | 5 | 9 |
| 2015 | 8 | 13 |
| 2016 | 12 | 18 |
| 2017 | 14 | 21 |
| 2018 | 18 | 18 |
| 2019 | 14 | 25 |
| 2020 | 20 | 27 |
| 2021 | 14 | 10 |
| 2022 | 12 | 11 |
| 2023 | 13 | 12 |
| 2024 | 7 | 5 |
| 2025 | 6 | 6 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic component and method of manufacturing the same29 Sep 2026US 12,750,954 B2Murata Manufacturing Co., Ltd.
- Substrate for printed wiring board and printed wiring board14 Apr 2026US 12,604,399 B2Sumitomo Electric Industries, Ltd.
- Printed circuit board7 Apr 2026US 12,598,702 B2Samsung Electro-Mechanics Co., Ltd.
- Semi-additive process for catalytic printed circuit boards30 Dec 2025US 12,513,827 B2Catlam, LLC
- Printed wiring board9 Dec 2025US 12,495,489 B2Ibiden Co., Ltd.
- Fabricating electronic devices with metallized internal structures using 3d printing and microfluidic electroless plating27 Aug 2026US 2026/0255484 A1Atomic Semi Inc.
- Circuit board and manufacturing method thereof23 Jul 2026US 2026/0214800 A1Samsung Electro-Mechanics Co., Ltd.
- Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package2 Jul 2026US 2026/0190248 A1Resonac Corporation
- Semi-Additive Process for Printed Circuit Boards11 Jun 2026US 2026/0164566 A1Catlam, LLC
- Electronic Board with Plated Through Hole and Axial and Radial Annular Protrusions14 May 2026US 2026/0136472 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Method of metallizing high aspect ratio apertures124US 5,576,052 AMotorola, Inc. · 1996