Method for producing printed wiring board, photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor package

Abstract

The present invention provides a method for producing a printed wiring board that exhibits high adhesive strength with plated copper while reducing surface roughness of an interlayer insulating layer, provides a photosensitive resin composition and a photosensitive resin film that can provide the printed wiring board, and provides the printed wiring board obtained by the method for producing the printed wiring board and a semiconductor package having the printed wiring board. The method for producing the printed wiring board is a method for producing the printed wiring board, the method including the following (1) to (4). (1): Laminating a photosensitive resin film containing particles (X) that dissolve 95% by mass or more in an aqueous sulfuric acid solution having a concentration of 5 to 100 ml/L under conditions of 70° C. for 20 minutes onto one or both sides of a circuit board. (2) Forming an interlayer insulating layer having a via by exposing and developing the photosensitive resin film laminated in the (1). (3-1) Performing roughening treatment on surfaces of the via and the interlayer insulating layer. (3-2) Dissolving the particles (X) present on the surface of the interlayer insulating layer by treating the interlayer insulating layer subjected to the roughening treatment with an acidic solution. (4) Forming a circuit pattern on the interlayer insulating layer.

Dependencies are inferred from the claim text.