H05K 3/425

Characterised by the sequence of steps for plating the through-holes or via

Official title: {characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern}

H05K3/425 (Characterised by the sequence of steps for plating the through-holes or via) appears on 1,098 US grants and 944 published applications in this corpus.

Search patents in H05K

Granted patents: 1,098
Published applications: 944
Assignees: 426
Inventors: 2,250
Latest grant: 19 May 2026

Filings by year

H05K 3/425: granted patents and published applications per publication year
Year	Granted patents	Published applications
1976	11	0
1977	5	0
1978	3	0
1979	2	0
1980	3	0
1981	11	0
1982	8	0
1983	10	0
1984	5	0
1985	13	0
1986	20	0
1987	15	0
1988	23	0
1989	25	0
1990	27	0
1991	22	0
1992	21	0
1993	16	0
1994	24	0
1995	22	0
1996	19	0
1997	27	0
1998	25	0
1999	17	0
2000	19	0
2001	21	16
2002	27	21
2003	20	23
2004	25	25
2005	11	28
2006	9	43
2007	23	42
2008	21	51
2009	24	68
2010	34	62
2011	38	44
2012	57	47
2013	38	44
2014	24	34
2015	27	40
2016	32	37
2017	42	25
2018	20	40
2019	32	39
2020	33	49
2021	34	36
2022	32	34
2023	27	35
2024	28	21
2025	21	21
2026	5	19

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Characterised by the sequence of steps for plating the through-holes or via

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