H05K 3/428
Initial plating of through-holes in substrates having a metal pattern
Official title: {initial plating of through-holes in substrates having a metal pattern}
H05K3/428 (Initial plating of through-holes in substrates having a metal pattern) appears on 143 US grants and 107 published applications in this corpus.
Search patents in H05K- Granted patents
- 143
- Published applications
- 107
- Assignees
- 82
- Inventors
- 320
- Latest grant
- 9 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 5 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 4 |
| 2002 | 1 | 1 |
| 2003 | 4 | 3 |
| 2004 | 2 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 4 |
| 2007 | 1 | 6 |
| 2008 | 4 | 7 |
| 2009 | 5 | 9 |
| 2010 | 3 | 7 |
| 2011 | 5 | 3 |
| 2012 | 8 | 4 |
| 2013 | 7 | 5 |
| 2014 | 2 | 4 |
| 2015 | 4 | 2 |
| 2016 | 1 | 4 |
| 2017 | 7 | 2 |
| 2018 | 3 | 8 |
| 2019 | 5 | 6 |
| 2020 | 5 | 10 |
| 2021 | 8 | 5 |
| 2022 | 1 | 3 |
| 2023 | 3 | 3 |
| 2024 | 3 | 1 |
| 2025 | 2 | 2 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995
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- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Encapsulated circuitized power core alignment and lamination88US 5,129,142 AInternational Business Machines Corporation · 1992
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