Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsHeinrich TRISCHLER, Erich PREINER, Marie SCALBERT
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Abstract
A method of manufacturing a component carrier, wherein the method comprises stamping a surface profile in a design layer, forming a metallic base structure in at least one indentation of the profiled design layer at least partially by electroplating, and electroplating an electroplating structure in the at least one indentation on or above the metallic base structure.
Claims29
A method of manufacturing a component carrier, the method comprising:
- stamping a surface profile in a design layer;
- forming a metallic base structure in at least one indentation of the profiled design layer at least partially by electroplating;
- and
- electroplating an electroplating structure in the at least one indentation on or above the metallic base structure.
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A component carrier, comprising:
- a design layer having a stamped surface profile;
- an at least partially electroplated metallic base structure in at least one indentation of the profiled design layer;
- and
- an electroplated electroplating structure in the at least one indentation on or above the metallic base structure.
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A component carrier, comprising:
- an electrically conductive layer;
- a stamped design layer arranged on the electrically conductive layer and having a surface profile with at least one indentation so that at least one surface portion of the electrically conductive layer is exposed with respect to the design layer;
- and
- an electroplated filling medium at least partially filling the at least one indentation.
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Dependencies are inferred from the claim text.