Substrate, method for manufacturing substrate, and electronic device
AssigneeFujitsu Interconnect Technologies Limited
InventorsHiroshi Nakano, Norikazu Ozaki
Life of this patent
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Abstract
A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.
Claims7
A substrate characterized by comprising:
- a sheet-shaped first base material having a penetrating hole in a thickness direction;
- and
- a second base material fitted into the penetrating hole,
- the second base material including multiple metal bodies, the metal bodies penetrating in the same direction as the thickness direction of the first base material and formed as a pattern wiring inside the first base material in a state of having an end exposed at each of a first surface and a second surface of the second base material that face each other in the thickness direction, and spaces between the multiple metal bodies at the first surface and spaces between the multiple metal bodies at the second surface differing from each other in such a manner that spaces of the pattern wiring formed inside the first base material change in a middle.
A method for manufacturing a substrate, characterized by comprising fitting a second base material into a penetrating hole in a thickness direction of a sheet-shaped first base material,
- the second base material, which is fitted into the penetrating hole of the first base material, including multiple metal bodies, the metal bodies penetrating in the same direction as the thickness direction of the first base material and formed as a pattern wiring inside the first base material in a state of having an end exposed at each of a first surface and a second surface of the second base material that face each other in the thickness direction;
- and
- cutting the first base material at a part at which spaces of a pattern wiring that is formed inside the first base material and that is to be used as the multiple metal bodies of the second base material change in a middle, the pattern wiring being formed inside the first base material in such a manner that the spaces of the pattern wiring change in the middle, whereby a third base material is obtained.
Dependencies are inferred from the claim text.