Encapsulated circuitized power core alignment and lamination
AssigneeInternational Business Machines Corporation
InventorsPerminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas
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Abstract
A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
Claims14
A method of making an encapsulated circuitized power core for a multilayered printed circuit board, said method comprising the steps of:
- providing a circuitized power core including a dielectric coated power plane, signal lines and lands located on external surfaces of said dielectric coated power plane, and a plurality of vias extending between said external surfaces;
- coating said circuitized power core with a first layer of dielectric material;
- opening up discrete areas in said first layer of dielectric material corresponding to preselected ones of said vias and lands in said circuitized power core;
- depositing an electrically continuous metal layer in said vias, on said lands and over said first layer of dielectric material;
- coating said electrically continuous metal layer with a second layer of dielectric material;
- opening up discrete areas in said second layer of dielectric material corresponding to said preselected ones of said vias and lands in said circuitized power core;
- metallizing said preselected ones of said vias by providing a quantity of joining metal therein;
- removing said second layer of dielectric material;
- and
- removing said electrically continuous metal layer such that said quantity of joining metal extends above said first layer of dielectric material.
Dependencies are inferred from the claim text.