Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSang Ho JEONG, Chang Hwa PARK, Sang Yun LEE, Hyun Hu LEE
Life of this patent
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Abstract
A printed circuit board is provided. The printed circuit board includes a glass layer having a through-hole; an insulating material disposed within the through-hole and having a via hole; and a metal via disposed within the via hole. The metal via includes a first metal layer that is substantially conformally disposed on a wall surface of the via hole, a second metal layer that is substantially conformally disposed on the first metal layer, and a third metal layer disposed on the second metal layer and filling at least a portion of the via hole.
Claims20
A printed circuit board, comprising:
- a glass layer having a through-hole;
- a first insulating material disposed within the through-hole and having a first via hole;
- and
- a first metal via disposed within the first via hole,
- wherein the first metal via includes a first metal layer in which at least a portion thereof is disposed on a wall surface of the first via hole, a second metal layer in which at least a portion thereof is disposed on the first metal layer, and a third metal layer disposed on the second metal layer and filling at least a portion of the first via hole.
A printed circuit board, comprising:
- a core portion including a glass core having a through-hole, an insulating material disposed within the through-hole and having a via hole, and a metal via disposed within the via hole;
- and
- a build-up portion including an insulating body disposed on the core portion, one or more interconnection layers respectively disposed on or within the insulating body, and one or more via layers respectively disposed within the insulating body,
- wherein the metal via includes a first metal layer in which at least a portion thereof is conformally disposed on a wall surface of the via hole, a second metal layer in which at least a portion thereof is conformally disposed on the first metal layer, and a third metal layer disposed on the second metal layer and filling at least a portion of the via hole.
A printed circuit board, comprising:
- a glass layer having a through-hole;
- a first insulating material disposed within the through-hole and having a first via hole;
- and
- a first metal via disposed within the first via hole,
- wherein the first metal via includes:
- a first metal layer in which at least a portion thereof is disposed on a wall surface of the first via hole;
- a second metal layer in which at least a portion thereof is disposed on the first metal layer;
- and
- a third metal layer disposed on the second metal layer and filling at least a portion of the first via hole,
- wherein a nano void is formed at a boundary between the second metal layer and the first metal layer.
Dependencies are inferred from the claim text.