US 11,882,656 B2 · Wiring substrate and method for manufacturing wiring substrate

Abstract

A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

Claims20

Dependent claims

A wiring substrate, comprising:

a first conductor layer;
an insulating layer formed on the first conductor layer;
a second conductor layer formed on the insulating layer;
a connection conductor penetrating through the insulating layer such that the connection conductor is connecting the first conductor layer and the second conductor layer;
and
a coating film formed on a surface of the first conductor layer such that the coating film is adhering the first conductor layer and the insulating layer,
wherein the first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on a second conductor layer side and that a surface roughness of the first region is different from a surface roughness of the second region, and the first conductor layer is formed such that the first region of the conductor pad is covered by the coating film and that the second region of the conductor pad is covered by the connection conductor.

4 more elements

A method for manufacturing a wiring substrate, comprising:

forming a first conductor layer having a conductor pad on a first insulating layer;
roughening an exposed surface of the first conductor layer formed on the first insulating layer;
forming a coating film on the first conductor layer such that the coating film covers the first conductor layer;
forming a second insulating layer on the first conductor layer and the coating film formed on the first conductor layer;
forming a second conductor layer on the second insulating layer;
and
forming a connection conductor in the second insulating layer such that the connection conductor penetrates through the second insulating layer and connects the conductor pad and the second conductor layer,
wherein the roughing of the exposed surface of the first conductor layer includes forming a surface of the conductor pad having a first region and a second region on an opposite side with respect to a first insulating layer side such that a surface roughness of the first region is different from a surface roughness of the second region, the forming of the coating film includes covering the first region with the coating film, and the forming of the connection conductor includes covering the second region with the connection conductor.

5 more elements

Dependencies are inferred from the claim text.

Wiring substrate and method for manufacturing wiring substrate

Life of this patent

Wiring substrate and method for manufacturing wiring substrate

Life of this patent

Abstract

Claims20