H05K 3/427
Initial plating of through-holes in metal-clad substrates
Official title: {initial plating of through-holes in metal-clad substrates}
H05K3/427 (Initial plating of through-holes in metal-clad substrates) appears on 624 US grants and 494 published applications in this corpus.
Search patents in H05K- Granted patents
- 624
- Published applications
- 494
- Assignees
- 268
- Inventors
- 1,272
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 14 | 0 |
| 1987 | 10 | 0 |
| 1988 | 18 | 0 |
| 1989 | 18 | 0 |
| 1990 | 21 | 0 |
| 1991 | 10 | 0 |
| 1992 | 15 | 0 |
| 1993 | 9 | 0 |
| 1994 | 15 | 0 |
| 1995 | 11 | 0 |
| 1996 | 11 | 0 |
| 1997 | 15 | 0 |
| 1998 | 14 | 0 |
| 1999 | 10 | 0 |
| 2000 | 14 | 0 |
| 2001 | 13 | 10 |
| 2002 | 19 | 11 |
| 2003 | 15 | 16 |
| 2004 | 11 | 13 |
| 2005 | 8 | 17 |
| 2006 | 4 | 26 |
| 2007 | 15 | 22 |
| 2008 | 13 | 32 |
| 2009 | 12 | 40 |
| 2010 | 21 | 32 |
| 2011 | 22 | 31 |
| 2012 | 30 | 27 |
| 2013 | 21 | 24 |
| 2014 | 16 | 19 |
| 2015 | 17 | 22 |
| 2016 | 20 | 17 |
| 2017 | 21 | 15 |
| 2018 | 10 | 16 |
| 2019 | 12 | 12 |
| 2020 | 14 | 22 |
| 2021 | 13 | 16 |
| 2022 | 14 | 15 |
| 2023 | 14 | 18 |
| 2024 | 17 | 8 |
| 2025 | 9 | 5 |
| 2026 | 2 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Electroless plating of nickel onto surfaces such as copper or fused tungston256US 5,147,692 AMacDermid, Incorporated · 1992
- Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets146US 5,841,099 AElectro Scientific Industries, Inc. · 1998