Component carrier with embedded component connected by galvanic connection stack

A component carrier, comprising:

• a layer body comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
• a component embedded in the layer body;
• and
• at least one galvanic connection stack at least partially on at least part of at least one main surface of the layer body;
• wherein at least one of a bottom main surface and a top main surface of the embedded component is electrically connected to the at least one galvanic connection stack,
• wherein the at least one galvanic connection stack comprising multiple planar layer structures with coextensive boundaries in a direction of the connection stack extends on the at least one main surface of the layer body and laterally beyond the component and has a portion comprising a wavy structure;
• wherein the multiple planar layer structures comprise a seed layer connected with a pad of the component where the seed layer provides an electrically conductive base for a layer deposited on the seed layer.