H05K 3/426
Initial plating of through-holes in substrates without metal
Official title: {initial plating of through-holes in substrates without metal}
H05K3/426 (Initial plating of through-holes in substrates without metal) appears on 364 US grants and 343 published applications in this corpus.
Search patents in H05K- Granted patents
- 364
- Published applications
- 343
- Assignees
- 188
- Inventors
- 849
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 4 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 11 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 7 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 9 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 5 |
| 2002 | 9 | 10 |
| 2003 | 3 | 7 |
| 2004 | 13 | 13 |
| 2005 | 6 | 11 |
| 2006 | 4 | 16 |
| 2007 | 8 | 16 |
| 2008 | 7 | 17 |
| 2009 | 10 | 26 |
| 2010 | 11 | 25 |
| 2011 | 15 | 17 |
| 2012 | 27 | 17 |
| 2013 | 12 | 13 |
| 2014 | 9 | 12 |
| 2015 | 3 | 11 |
| 2016 | 9 | 16 |
| 2017 | 15 | 10 |
| 2018 | 6 | 9 |
| 2019 | 13 | 14 |
| 2020 | 12 | 16 |
| 2021 | 11 | 10 |
| 2022 | 12 | 10 |
| 2023 | 9 | 12 |
| 2024 | 7 | 9 |
| 2025 | 6 | 9 |
| 2026 | 1 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Two signal one power plane circuit board145US 6,204,453 B1International Business Machines Corporation · 2001
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991