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US 12,388,049 B2Granted
High connectivity device stacking
AssigneeApplied Materials, Inc.
InventorsKurtis Leschkies, Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Jeffrey L. Franklin, Wei-Sheng Lei
Life of this patent
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Abstract
The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.
Claims16
A semiconductor device assembly, comprising:
- a first printed circuit board (PCB) comprising:
- a first glass fiber reinforced epoxy resin material;
- and
- a first electrical distribution layer formed on the first glass fiber reinforced epoxy resin material;
- a second PCB comprising:
- a second glass fiber reinforced epoxy resin material;
- and
- a second electrical distribution layer formed on the second glass fiber reinforced epoxy resin material;
- and
- a device spacer interposed between the first PCB and the second PCB to facilitate a physical space therebetween, the device spacer further comprising:
- a frame having a first surface opposite a second surface, the frame further comprising:
- a frame material comprising a polymer-based dielectric material having ceramic filler particles;
- and
- a via comprising a via surface that defines an opening extending through the frame from the first surface to the second surface, the via having a first diameter of about 10 μm and about 150 μm;
- an electrical interconnection disposed within the via on the via surface to form at least part of a conductive path extending between at least a portion of the first and second electrical distribution layers;
- and
- solder bumps conductively coupling the electrical interconnection with the first and second electrical distribution layers.
14 more elements
Dependencies are inferred from the claim text.