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US 12,349,288 B2Granted
Circuit board including a core layer provided with plurality of insulating layers
AssigneeLG Innotek Co., Ltd.
InventorsMyung Jae Kwon, Sang Hyuck Nam, Jin Hyoung Park
Life of this patent
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Abstract
A semiconductor package according to an embodiment includes a first insulating layer including a through hole; an insulating member disposed in the through hole of the first insulating layer; a first electrode layer disposed on the insulating member; a second insulating layer disposed on the first electrode layer; and a first through electrode passing through the second insulating layer, wherein the first through electrode overlaps the first electrode layer and the insulating member in a vertical direction.
Claims17
A circuit board comprising:
- a first insulating layer including a through hole;
- an insulating member disposed in the through hole of the first insulating layer;
- a first through electrode disposed in the through hole of the first insulating layer and surrounding at least a part of the insulating member;
- a first electrode layer disposed on the insulating member and the first through electrode;
- a second insulating layer disposed on the first electrode layer;
- and
- a second through electrode passing through the second insulating layer,
- wherein the second through electrode overlaps the first electrode layer and the insulating member in a vertical direction,
- wherein the first electrode layer includes a first region overlapping the first insulating layer in the vertical direction, and a second region overlapping the insulating member in the vertical direction, and
- wherein a thickness of the first region of the first electrode layer is different from a thickness of the second region of the first electrode layer.
7 more elements
Dependencies are inferred from the claim text.