Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorYong Wan Ji
Life of this patent
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Abstract
The present disclosure relates to a printed circuit board including: a glass layer having an upper surface and a lower surface, and a side surface connecting the upper surface and the lower surface; a through-hole penetrating between the upper surface and the lower surface of the glass layer; and a metal via filling at least a portion of the through-hole, where at least one of the upper surface and the lower surface of the glass layer, and at least one of the upper surface and the lower surface of the metal via respectively have a surface roughness greater than a surface roughness of a side surface of the glass layer.
Claims20
A printed circuit board, comprising:
- a glass layer having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface;
- a through-hole penetrating between the upper surface and the lower surface of the glass layer;
- and
- a metal via filling at least a portion of the through-hole,
- wherein at least one of the upper surface and the lower surface of the glass layer, and at least one of the upper surface and the lower surface of the metal via respectively have a surface roughness greater than a surface roughness of a side surface of the glass layer.
A printed circuit board, comprising:
- a glass layer having an upper surface and a lower surface, and a side surface connecting the upper surface and the lower surface;
- a through-hole penetrating between the upper surface and the lower surface of the glass layer;
- and
- a metal via filling at least a portion of the through-hole,
- wherein the upper surface and the lower surface of the glass layer, and an upper surface and a lower surface of the metal via respectively have an average roughness Ra in a range from 0.1 μm to 10 μm.
A printed circuit board, comprising:
- a glass layer having a top surface, a bottom surface and a side surface connecting the top and bottom surfaces, a surface roughness of the top and/or bottom surfaces being greater than a surface roughness of the side surface;
- a through-hole penetrating through the glass layer between the top and bottom surfaces;
- and
- a metal via at least partially filling the through-hole,
- wherein, in a cross-section view, a top surface of the metal via protrudes above the top surface of the glass layer by a distance greater than the surface roughness of the top surface of the glass layer.
Dependencies are inferred from the claim text.