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US 12,522,559 B2Granted
Leveling agent and electrolytic composition for filling via hole
AssigneeYmt Co., Ltd.
InventorsSung Wook Chun, Bo Mook Chung, Dea Geun Kim, Nak Eun Ko, Ju Yong Sim
Life of this patent
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Abstract
The present invention relates to a leveling agent and an electrolytic composition comprising the same. When the via hole in the substrate is filled with the electrolytic composition according to the present invention, the via hole can be filled within a relatively short time while minimizing the formation of dimples or voids.
Claims8
A leveling agent which is a compound represented by Formula 1 or Formula 2 below:
- wherein,
- R1 to R4 are each independently selected from the group consisting of a C1 to C10 alkyl group, a C6 to C20 aryl group, and a C2 to C20 heteroaryl group, and, when two or more of R1-R4 are present, the R1 and R2 groups may be the same or different from each other,
- R5 is selected from the group consisting of a C1 to C10 alkyl group, a C6 to C20 aryl group, a C2 to C20 heteroaryl group, and —NR10R11, and, when two or more R5 groups are present, the R5 groups may be the same or different from each other,
- R6 and R7 are each independently selected from the group consisting of a C1 to C10 alkyl group, a C6 to C20 aryl group and a C2 to C20 heteroaryl group,
- n is an integer from 1 to 10,
- R10 and R11 are each independently selected from the group consisting of hydrogen, a C1 to C10 alkyl group, and a C6 to C20 aryl group, and
- each of the alkyl group, the aryl group and the heteroaryl group of R1 to R7 is each independently substituted or unsubstituted with one or more substituents selected from the group consisting of a halogen group, a C1 to C10 alkyl group, and a C6 to C20 aryl group.
4 more elements
Dependencies are inferred from the claim text.