H05K 3/421
Blind plated via connections
Official title: {Blind plated via connections (H05K3/422, H05K3/423 and H05K3/425 take precedence)}
H05K3/421 (Blind plated via connections) appears on 410 US grants and 538 published applications in this corpus.
Search patents in H05K- Granted patents
- 410
- Published applications
- 538
- Assignees
- 191
- Inventors
- 1,060
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 1 |
| 2002 | 1 | 7 |
| 2003 | 6 | 12 |
| 2004 | 13 | 9 |
| 2005 | 3 | 20 |
| 2006 | 9 | 32 |
| 2007 | 13 | 27 |
| 2008 | 14 | 22 |
| 2009 | 13 | 40 |
| 2010 | 26 | 26 |
| 2011 | 22 | 32 |
| 2012 | 31 | 24 |
| 2013 | 17 | 19 |
| 2014 | 18 | 21 |
| 2015 | 16 | 24 |
| 2016 | 19 | 27 |
| 2017 | 20 | 24 |
| 2018 | 19 | 16 |
| 2019 | 15 | 15 |
| 2020 | 15 | 21 |
| 2021 | 18 | 14 |
| 2022 | 15 | 28 |
| 2023 | 15 | 21 |
| 2024 | 20 | 24 |
| 2025 | 13 | 13 |
| 2026 | 10 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Printed wiring board17 Mar 2026US 12,581,597 B2Ibiden Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Package substrate and fabricating method thereof13 Aug 2026US 2026/0239533 A1AaltoSemi Inc.
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Multilayer circuit board with embedded module30 Jul 2026US 2026/0223296 A1Avary Holding (Shenzhen) Co., Limited.
Most cited
By later US patents
- Method of manufacturing multilayer printed wiring board145US 5,826,330 AHitachi AIC Inc. · 1998
- Method for manufacturing high-density multilayer printed circuit boards127US 6,119,338 AIndustrial Technology Research Institute · 2000
- PCB design and method for providing vented blind vias122US 6,787,443 B1Intel Corporation · 2004
- Multi-layer double-sided wiring board and method of fabricating the same113US 6,803,528 B13M Innovative Properties Company · 2004
- PCB droplet actuator fabrication112US 8,268,246 B2Advanced Liquid Logic, Inc. · 2012